Symbion S36
features the ultimate in user simplicity, advanced detection techniques and closet-loop process control capabilities to dramatically boost your productivity and improve product quality – all while achieving major operational cost savings. It gives you top-of-the-line AOI performance to meet the inspection challenges of today’s most demanding high-mix and high-volume SMT environments.
DPIX Technology
DPIX (Dimensional Picture Information eXtraction) is Orbotech’s ground-breaking detection technology which has been specifically designed to deliver optimum inspection results on today’s complex, densely-packed electronics assemblies. DPIX features a highly-effective combination of specialised 3-D image acquisition and image processing techniques. The result is the highest accuracy detection with greatly minimised false calls and without a compromise on speed.
Specialised 3-D optics feature a combination of one high resolution top camera and 4 angled cameras together with structured lighting for clear, multi-dimensional image acquisition. Precise measurement of component position and full coverage of solder defects such as J-Legs or lifted fin-pich leads are guaranteed. Component feature information extracted from multiple images is analysed simultaneously using powerful image processing algorithms and techniques. This ensures the highest detection of all visible component and solder joint defects regardless of their geometries or background variations.
Fast inspection
The system adapts automatically to product and component changeovers. Built-in self diagnostics of optics and lighting ensures continually optimised performance. With scan speed of up to 40cm2 per second, Symbion S36 matches the beat rates of even the fastest SMT lines.
Simple operation
The intuitive, graphical Wizard interface guides you through each stage of recipe creation and programmes generation, reducing dramatically programming, setting and training times.
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