Products > AOI > PREVIOUS SERIES AND SOFTWARES:
 SYMBION P36 - 3-D SOLDER PASTE AOI SYSTEM
Symbion P36 is the last generation of Solder Paste AOI Systems. Based on the revolutionary POP (Parallel Optical Path) Technology, it is the first solder paste AOI system to use simultaneous 2-D and 3-D area and volumetric measurements at ultra-high speed without compromising accuracy.
POP Technology
Employing an optimised serpentine scanning technique, with two scan lines operating simultaneously via independent optical channels for area and height image acquisition, POP enables 100% full board coverage and precise measurements of solder paste deposit volume, area, shape, and location.
Orbotech’s unique 3-D laser triangulation method provides a clear, angled view for solder paste height mapping at the fine resolution of 5 µm. This is combined with a true 2-D laser illumination channel for excellent top views of the solder paste area at 20x20 µm resolution. The result is an exceptionally quick and complete picture of each solder paste deposit with virtually no false calls.
Ultra-Fast
Up to 3 times faster than a current solution at similar resolution, Symbion P36 overcomes the limitations of existing paste inspection systems integrating itself in a progressive inspection strategy for high quality results and highest yield and throughput on even the most difficult SMT applications.
Simple Operation
The system features the ultimate in “point & click” simplicity with a user friendly graphic wizard interface that dramatically reduces setup time and operator requirements. Syymbion P36 is an ideal solution for any production environment; it easily handles all board complexities and solder paste materials including lead free.
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