Products > Laser Cutting
 MYAUTOMATION
MyAutomation manufactures standard systems for special applications as Dispensing, Odd-shape component Mounting, Laser Marking, Labelling, Screwing and Laser cutting.
In co-operation with the Customer, MyAutomation can find out the best configuration for every production line and for any kind of process.
In the field of electronic manufacturing MyAutomation represents a successful solution for every production need. |
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 MyCell - ARESŪ Laser Cutting System
The laser cutting cell can be used for cutting PCB of 0,8 – 2mm thickness (more on request).
The laser cutting technology avoids mechanical stress on PCBs and components, it is faster compared to traditional systems and it produces a very limited quantity of dust.
A dedicated CO2 laser with a jet air cooling systems reduces considerably the burning surface of a PCB; with nitrogen nozzle it can be reduced even more.
While cutting, a light-grey surface can be produced.
Different power sources for a different thickness or a higher speed can be offered on request.
The sistem features also a nitrogen nozzle (on request).
A dust vacuum cleaner with special filters is also available.
The system can be in-line or stand-alone; one or two trays can be offered.
A user-friendly interface allows an easy learning in a very short time.
A LCD camera can be offered for teaching or for fiducial alignment.
The system will be available also for aluminium and ceramic PCBs very soon.
> MyCell - ARESŪ Laser Cutting System
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